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Titanium Nitride (TiN) |
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| Titanium Nitride possesses many strong points, when it's used in film-plating and device production this material can effectively improve the hardness,melting point, and chemical stability of the products. Otherwise, this material have excellent electric conductance, so it can be used to make electrode and electric contact. | |
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Titanium
Nitride (TiN) Sputtering Target Shape--- Discs, Plate,Step (Dia ≤200mm,, Thickness ≥1mm) Rectangle, Sheet, Step (Length ≤300mm, Width ≤200mm, Thickness ≥1mm) Tube( Diameter< 300mm, Thickness >2mm ) Application --- Titanium films are becoming more widely used as passivation layers for VLSI, decorative gold coatings, and wear coatings. A reactive sputtering process can deposit titanium nitride films with excellent electrical, mechanical, and optical properties. |
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Titanium Nitride (TiN) Powder Purity--- 98%, 99% Shape--- Powder,40-300mesh Application---additive in cemented carbides, ceramic, spraying coating raw material... |
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Titanium Nitride (TiN) Nanometer Powder Purity---97% Oxygen content --- <1.0wt% Color --- black Crystallographic form --- Cube Morphology---spherical Average particle size (D50) --- <14nm Specific surface area --- >80m2/g Apparent density --- 0.08g/cm3
Application --- Barrier layer in contact and interconnect metallizations, Bio-materials, Cutting tools, Forming tools, Gate electrode in metal-oxide-semiconductor (MOS) transistors, Low-barrier Schottky diode, Nanocomposites, Optical devices in aggressive, environments, Plastic molds, Prostheses, Surgical instruments, high temperatures crucibles and decorate materials, wear-resistant coating... |
