|
Titanium
Nitride (TiN) |
|
Titanium Nitride
possesses many strong points, when it's used in film-plating and
device production this material can effectively improve the hardness,melting
point, and chemical stability of the products. Otherwise, this material
have excellent electric conductance, so it can be used to make electrode
and electric contact. |
|
Titanium
Nitride (TiN) Sputtering Target
Purity---98%,
99%
Shape---
Discs,
Plate,Step (Dia
≤200mm,,
Thickness ≥1mm)
Rectangle, Sheet, Step (Length
≤300mm, Width ≤200mm, Thickness ≥1mm)
Tube( Diameter< 300mm, Thickness >2mm )
Application ---
Titanium films are becoming more widely used as passivation layers for VLSI,
decorative gold coatings, and wear coatings. A reactive sputtering process
can deposit titanium nitride films with excellent electrical, mechanical, and
optical properties. |
|
Titanium
Nitride (TiN) Powder
Purity---
98%, 99%
Shape---
Powder,40-300mesh
Application---additive
in cemented carbides, ceramic, spraying coating raw material... |
|
Titanium
Nitride (TiN) Nanometer Powder
Purity---97%
Oxygen
content --- <1.0wt%
Color ---
black Crystallographic
form ---
Cube Morphology---spherical
Average
particle size (D50) --- <14nm
Specific
surface area --- >80m2/g
Apparent
density --- 0.08g/cm3
Manufacture
method --- Plasma arc vapor
Application --- Barrier layer in
contact and interconnect metallizations, Bio-materials, Cutting tools, Forming
tools, Gate electrode in metal-oxide-semiconductor (MOS) transistors,
Low-barrier Schottky diode, Nanocomposites, Optical devices in aggressive,
environments, Plastic molds, Prostheses, Surgical instruments, high temperatures crucibles and decorate
materials, wear-resistant
coating... |
|
