Sputter Coating Application: Sputter coating thin film primary be used field include decorate thin film, construction glass, automobile widow, low radiation glass, plane display, optical communication/ optics field, light date store field, thin film solar cell, magnetism date store field. ( Details )

Sputtering targets fabrication methods:
CRM have lots of fabrication methods, and we will select the best ways to manufacture products base on raw materials speciafication. Some available methods show as below: Vacuum Induction Melting (VIM), Vacuum induced levitation melting furnace Vacuum Sintering, Vacuum Melting Casting, Vacuum Arc Melting, Hot Pressing (HP), Hot Isostatic Pressing (HIP), Cold Isostatic Pressing(CIP), cold pressing and sinter, FZ, CZ, CVD...... Now our plasma spray technique is studying and improving, we will can offer some samples.

Backing Plates and Bonding Service: Backing plates include OFHC copper, Aluminum, Titanium, Stainless steel or Molybdenum. The dimension will base on your drawing and you design. 
Bonding Service
º Back metallisation up to 1600 x 1000mm
º Metallic and non-metallic bond coverage >98%
º Ultrasonic c-scan on bond integrity

Sputtering Targets Shape and Size: Discs, Rectangle, Step, Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns, Custom-Made.
Disk targets, column targets, step wafer targets (Dia<350mm, Thickness >1mm )
Rectangle Targets, Slice Targets, Step Rectangle Targets (Longth <1500mm, Witdh<300mm, Thickness>1mm)
Tube Target / Rotation sputtering Target (Outer Dia < 300mm, Thickness > 2mm)
Sputtering Targets Materials list:
Metal sputtering target: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)
Alloy Sputtering Targets:AlCu, AlCr,AlMg,AlSi,AlSiCu,AlAg,AlV,CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt,CoNbZr,CoTaZr, CoZr,CrV,CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi,NiTi,NiV,SmCo,AgCu, AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr,WRe,WTi,WCu, ZrAl,ZrCu,ZrFe,ZrNb,ZrNi,ZrTi,ZrY,ZnAl,ZnMg
Ceramic sputtering target:
Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2
Carbide Ceramic Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC
Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3
Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN
Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO)
Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe
Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2
Sulfides Ceramic Sputtering Targets: CuS, Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnS
Tellurides Ceramic Sputtering Targets:CdTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe
Other: AZO,Cr-SiO,CIGS,ITO,IGZO, GaAs, Ga-P, In-Sb, InAs, InP, InSn, LSMO, Na3AlF6 ,YBCO, LCMO,YSZ