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Special
Topics
Sputtering
Targets
Pure
Metals Targets
Alloy
and Intermetallics Target
Ceramic
Targets
Substrate
Wafer
Evaporation
Materials
Spraying
Materials
High
Pure Materials
Precious
Metal
Rare
Earth Material
Crystal
Materials
Nanometer
Materials
Advance
Materials
Alloy Sputtering target
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Sputtering Targets
China
rare metal material co.,ltd (CRM) is an experter in supplying sputtering targets.
CRM can offers a full line of sputtering targets with various components from industrial
 grade to super high purity. Mostly targets are manufacture by program. Also CRM can manufacture targets that are less and rare frequently used compositions. Also CRM can offer some addition server include substrade, bonding, backing plate. China
rare metal material co.,ltd insisted on improving our fabrication
techniques for supply more values and better products.
Sputtering targets fabrication methods:
Vacuum Induction Melting (VIM), Vacuum
induced levitation melting furnace Vacuum Sintering, Vacuum Melting Casting, Vacuum Arc Melting, Hot Pressing (HP), Hot Isostatic Pressing
(HIP), Cold Isostatic Pressing(CIP)...... Now our plasma spray technique is
studying and improveing, we will can offer some target sample.
Sputtering Targets Shape and Size: Discs,
Rectangle, Step, Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns, Custom-Made.
Disk targets, column targets, step wafer targets (Dia<350mm, Thickness >1mm )
Rectangle Targets, Slice Targets, Step Rectangle Targets (Longth <1500mm, Witdh<300mm, Thickness>1mm)
Tube Target / Rotation sputtering Target (Outer Dia < 300mm, Thickness > 2mm)
Sputter Coating Application: Sputter coating thin film primary be used field include decorate thin film, construction glass,automobile widow, low radiation glass,plane display,optical communication/ optics field, light date store field, magnetism date store field. ( Details )
Backing Plates and Bonding Service: Backing plate include OFHC
copper, Aluminum, Titanium, Stainless
steel or Molybdenum.
The dimension will base on your drawing and you design.
Bonding Service
º Back metallisation up to 1600 x 1000mm
º Metallic and non-metallic bond coverage >98%
º Ultrasonic c-scan on bond integrity
Substrate
Wafer, China Rare Metal Material
Co., Limited offer a complete line substrate with good surface.
Sputtering Targets Materials list:
Metal sputtering target: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)
Alloy Sputtering Targets:AlCu, AlCr,AlMg,AlSi,AlSiCu,AlAg,AlV,CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt,CoNbZr,CoTaZr, CoZr,CrV,CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi,NiTi,NiV,SmCo,AgCu, AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr,WRe,WTi,WCu, ZrAl,ZrCu,ZrFe,ZrNb,ZrNi,ZrTi,ZrY,ZnAl,ZnMg
Ceramic sputtering target:
Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2
Carbide Ceramic Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC
Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3
Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN
Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO)
Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe
Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2
Sulfides Ceramic Sputtering Targets: Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnS
Tellurides Ceramic Sputtering Targets:CdTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe
Other: Cr-SiO, GaAs, Ga-P, In-Sb, InAs, InP, InSn, LSMO, YBCO, LCMO
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