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Copper
Sputtering Targets / Copper Backing
Density
---
8.96 g/cm3
Purity---
99.9%,99.95%,99.99%
Shape---
Discs,
Plate,Step (Dia ≤500mm,, Thickness ≥1mm)
Rectangle, Sheet, Step (Length
≤1000mm, Width ≤500mm, Thickness ≥1mm)
Tube( Diameter< 508mm, Thickness >3mm, )
Application ---
Copper target primary is used Junction films in integrated circuits, Contacts. |
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Copper
Evaporation Material
Purity---
99.9-99.99% or international standards typeShape---
Wire, Powder, Piece, cylinder, pellet, taper
Diamension---Wire(0.5-6mm);
Cylinder(Dia3mmX10mm);Powder(200mesh,300mesh);Piece( 0.2-3mm)
Application
--- Junction films in integrated circuits. Contacts. |
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Super High Pure Copper
Metal ( Cu metal )
Purity --- 99.999
(Si,P,S,Cr,Mn,Fe,Ni,Co,Zn,As,Se,Ag,Cd,Sb,Sn,Te,Pb,Bi
total<10ppm) ,
99.9999%(Si,
P, S, Cr, Mn,
Fe, Ni, Co, Zn,
As, Se, Ag, Cd, Sb, Sn, Te, Pb, Bi total<1ppm)
Shape
--- Sheet, ingot, Disk, plate, Sputtering target
Application
--- Raw material sputtering target, micro-electronics, photoelectron,
semiconductor, integrated circuits, contacts |