Nitrogen(N) Element
Metals
Alloys Compounds
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| Basic
Information |
Name: Nitrogen
Symbol: N
Atomic Number: 7
Atomic Mass: 14.00674 amu
Melting Point: -209.9 ¡ãC (63.250008 ¡ãK, -345.81998
¡ãF)
Boiling Point: -195.8 ¡ãC (77.35 ¡ãK, -320.44 ¡ãF) |
Number
of Protons/Electrons: 7
Number of Neutrons: 7
Classification: Non-metal
Crystal Structure: Hexagonal
Density @ 293 K: 1.2506 g/cm3
Color: colorless |
Product
List
Metals (Top)
Alloys (Top)
| Name |
Sign |
Purity |
Shape |
Aluminum
Nitride |
AlN |
97%-98% |
Sputtering
Target, Evaporation Material, Substrate,Nanometer Powder, Plate,
Sheet, Disk, Powders(40-300mesh) |
Boron Nitride |
BN |
99.5% |
Sputtering
Target, Evaporation Material, Crucible,
Plate, Sheet, Disk, Powders,Boat |
Chromium
Nitride |
CrN |
98%-99% |
Sputtering
Target, Evaporation Material, Substrate, Plate, Sheet, Disk, Powders(40-300mesh) |
Chromium
Carbonitride |
CrCN |
98%-99.5% |
Sputtering
Target, Evaporation Material, Substrate, Plate, Sheet, Disk, Powders(40-300mesh) |
Hafnium
Nitride |
HfN |
98%-99% |
Sputtering
Target, Evaporation Material, Plate,
Sheet, Disk, Powders(40-300mesh) |
Silicon
Nitride |
Si3N4 |
98%-99% |
Sputtering
Target, Evaporation Material, Substrate,Nanometer Powder, Plate,
Sheet, Disk, Powders(40-300mesh) |
Niobium
Nitride |
NbN |
98%-99% |
Sputtering
Target, Evaporation Material, Plate, Sheet, Disk, Powders(40-300mesh) |
Titanium
Carbonitride |
TiCN |
98%-99% |
Sputtering
Target, Evaporation Material, Substrate, Plate, Sheet, Disk, Powders(40-300mesh) |
Tantalum Nitride |
TaN |
99.99% |
Sputtering
Target, Evaporation Material, Substrate, Plate, Sheet, Disk, Powders |
Titanium
Nitride |
TiN |
98%-99% |
Sputtering
Target, Evaporation Material, Substrate, Nanometer
Powder, Plate,
Sheet, Disk, Powders(40-300mesh) |
Vandium
Nitride |
VN |
98%-99% |
Sputtering
Target, Evaporation Material, Plate,
Sheet, Disk, Powders(40-300mesh) |
Zirconium
Nitride |
ZrN |
97%-99% |
Sputtering
Target, Evaporation Material, Substrate, Plate, Sheet, Disk, Powders(100-300mesh) |
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