Copper Bismuth (Cu-Bi) Alloy

Copper Bismuth (Cu-Bi) Alloy Sputtering Targets

Purity: 99.99%

Manufacturing Process

Melting ---> Casting ---> Forging (Rolling) ---> Machining ---> Checking ---> Packing

Speciafication (Max)

Planar circular target: Dia ≤480mm, Thickness ≥1mm

Planar Rectangle: Length ≤1800mm, Width ≤300mm, Thickness ≥1mm)

Totary Target: Diameter≤ 200mm,  Thickness >2mm)

Application ---

Our Advantage of Copper Bismuth (Cu-Bi) Alloy Sputtering Targets

China rare metal material co.,limited (CRM) is an experter in manufacture Copper Bismuth (Cu-Bi) Alloy Sputtering Targets as evaporation material . All Copper Bismuth (Cu-Bi) Alloy Sputtering Targets are manufacture by programs with  with the highest possible density and smallest possible average grain size.. 

CRM material co.,limited is specialized in making sputtering targets. We have many raw material compounds line, such as semiconductor line, chemical compounds line, metallurgy line, powder milling line, etc. Moreover, we introduced many advanced technology and equipments from related companies at home and aborad. We also have an experienced research team who have developed many new and special pellets, and also successfully made many trial orders and received many customers satisfaction and long-term friendship. 

All Copper Bismuth (Cu-Bi) Alloy Sputtering Targets are analyzed using best detection means including chemical analysis, Crystal phase microscope, x ray diffraction(XRD), X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP).

Copper Bismuth (Cu-Bi) Alloy Sputtering Targets phase diagram