Copper Sputtering Targets - Cu Target

Copper Sputtering Targets - Cu Target

• Purity---
• 99.9％,99.95％,99.99％

• Shape---
• Discs, Plate,Step,Rectangle, Sheet,Tube

• Dimension---

• Discs, Plate,Step (Dia <>≤500mm,,  Thickness <>≥1mm)

  Rectangle, Sheet, Step (Length ≤1000mm, Width ≤500mm, Thickness <>≥1mm)

  Tube( Diameter< 508mm,  Thickness >3mm )

• Property---

• Application---
• Copper target primary is used Junction films in integrated circuits, Contacts.